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  • Oh Yong Jung, Hyun Gi Seok, Anjana Dissanayake, and Sang Gug Lee. A 45μW, 162.1dBc/Hz FoM, 490MHz, Two-stage Differential Ring VCO Without a Cross-coupled Latch. IEEE Transactions on Circuits and Systems II: Express Briefs, 65(11), 1579-1583, Nov. 2018.
  • Suna Kim, Muhammad Ibrahim Wasiq Khan, Dae Woong Park, Sang Gug Lee, and Kyung Rok Kim. "Effects of Parasitic Source/Drain Junction Area on Terahertz Responsivity of MOSFET Detector." IEEE Transactions on Terahertz Science and Technology 8.6, 681-687, NOV. 2018.
  • Baek Min Lim, Jeong-Il Seo, and Sang Gug Lee. "A colpitts oscillator-based self-starting boost converter for thermoelectric energy harvesting with 40-mV startup voltage and 75% maximum efficiency." IEEE Journal of Solid-State Circuits 53.11, 3293-3302, Nov. 2018.
  • J. I. Seo, B. M. Lim and S. G. Lee, "A 96.5% Efficiency Current Mode Hysteretic Buck Converter With 1.2% Error Auto-Selectable Frequency Locking," in IEEE Transactions on Power Electronics, vol. 33, no. 9, pp. 7733-7743, Sept. 2018.
  • D. R. Utomo, D. W. Park, S. G. Lee and J. P. Hong, "High-Power 268-GHz Push-Push Transformer-Based Oscillator With Capacitive Degeneration," in IEEE Microwave and Wireless Components Letters, vol. 28, no. 7, pp. 612-614, July 2018.
  • H. Nguyen, K. Kim, S. Han, J. Lee, C. Kim and S. Lee, "A Low-Power Interference-Tolerance Wideband Receiver for 802.11af/ah Long-Range Wi-Fi With Post-LNA Active N-Path Filter," in IEEE Transactions on Microwave Theory and Techniques, vol. 66, no. 5, pp. 2287-2298, May 2018.
  • M. I. W. Khan, S. Kim, D. W. Park, H. J. Kim, S. K. Han and S. G. Lee, "Nonlinear Analysis of Nonresonant THz Response of MOSFET and Implementation of a High-Responsivity Cross-Coupled THz Detector," in IEEE Transactions on Terahertz Science and Technology, vol. 8, no. 1, pp. 108-120, Jan. 2018.
  • D. W. Park, D. R. Utomo, B. H. Lam, J. P. Hong, and S. G. Lee, "A 280-300GHz Three-Stage Amplifiers in 65-nm CMOS With 12-,9-dB Gain and 1.6, 1.4% PAE While Dissipating 17.9 mW,"in IEEE Microwave and Wireless Components Letters, Vol.28 , Issue.1 , page 79-81, Jan. 2018 .